UK chipmaker EnSilica forms a partnership with Taiwan’s leading semiconductor company.
- The partnership aims to enhance chip performance and efficiency for AI and mobile applications.
- EnSilica becomes a member of TSMC’s Design Center Alliance to overcome design challenges.
- This collaboration aligns with EnSilica’s growth strategy following recent achievements.
- EnSilica reports increased revenues and steady share performance, reflecting its market strength.
UK chipmaker, EnSilica, has strategically partnered with Taiwan’s largest semiconductor firm to expedite technological advancements in the sector. This collaboration is aimed at fostering innovation and enhancing the performance and efficiency of chips, particularly for AI and mobile applications.
EnSilica has officially joined the Design Center Alliance of the Taiwan Semiconductor Manufacturing Company (TSMC)’s Open Innovation Platform. This initiative is designed to lower design hurdles and facilitate first-time silicon success, thereby streamlining the innovation process for semiconductor designers seeking to amplify performance and power efficiency.
According to EnSilica, this partnership significantly bolsters its capability to enable the development of next-generation system-on-chips. These include mixed signal devices for both industrial and automotive applications, as well as communication and edge artificial intelligence chips, utilizing TSMC’s cutting-edge process technologies.
Ian Lankshear, CEO of EnSilica, remarked, “Joining the TSMC DCA programme marks a significant achievement for EnSilica. Our deep expertise in mixed signal and RF design, combined with TSMC’s advanced technology, positions us to deliver unparalleled solutions to our mutual customers.”
Dan Kochpatcharin, Head of Ecosystem and Alliance Management Division at TSMC, further commented, “TSMC is committed to collaborating with our OIP ecosystem partners, including EnSilica, to empower customers in achieving their design goals and quickly bringing their innovation to market.”
This partnership represents another major milestone for EnSilica as it continues to expand. The company recently secured a new ASIC design and supply contract with Siemens AG and celebrated the shipment of five million ASICs for a carmaker’s chassis control units.
EnSilica’s latest financial results indicate a promising trajectory with half-year revenues climbing to £9.6 million – an 11.5% increase compared to the previous year – despite a slight rise in pre-tax losses to £309,000. The company’s stock price remains unchanged in early trading in London but has seen a one-third increase since the year began.
EnSilica’s collaboration with Taiwan’s semiconductor leader marks a pivotal step in its quest for innovation and growth in the competitive chip-making industry.
